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iPhone 11 motherboard teardown - what to do?

Since the iPhone 11 released, the phone repair tools factory has started operations, they started dismantling the iPhone 11 to understand its construction, and began to prepare the tools to repair it, here is the iPhone 11 motherboard teardown process.




First use phone opening tools to disassemble the iPhone 11, disconnect the iPhone 11 battery, take off the iPhone 11 motherboard.

Now we need to separate the iPhone 11 motherboard double layers. Use hot air gun to heat the iPhone 11 motherboard for a while, and then use Titanium Alloy Tweezers to remove the upper layer board.

Observing the iPhone 11 motherboard, we can see that the iPhone 11 baseband CPU is Intel version.

Test the iPhone 11 upper layer logic board to check if it's same as the previous iPhone can be turned on by a single logic board. After testing, yes, it can, just be baseband.

The iPhone 11 uses the fastest A13 chip，put iPhone 11 motherboard under a Trinocular Microscope, and then use hot air gun and BGA graver to remove the iPhone 11 CPU.

Insert a BGA remove blade start from "3", and carefully move it to "1", but don't approach the "A". Try to pry the iPhone 11 CPU, and then remove it.

Apply some solder paste to the iPhone 11 CPU solder pad to remove the glue, and then remove the glue on the iPhone CPU.

Reballing the iPhone CPU,  use DES H95 hot air gun to install the A13 back the motherboard,and then assemble the iPhone 11 motherboard.

Finally, assemble the iPhone 11, press the power button, the iPhone 11 is turned on properly. After entering the IOS system, test the functions on the iPhone 11, all works well.
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